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Home Products > BGA Grinding System

eDPL-SG BGA Grinding System

Features

  • Precision Processing by Laser Displacement Sensor
  • High Efficiency Dust Collecting System
  • Additional Part Processing Function
  • Full Graphic Interface & Easy Programming
  • Desktop Type Compact Design

Options

  • Installation Table

Features

  • BGA Chip Processing
    It is easy to check the cause analysis of NG and remove NG BGA chip by processing the upper side of NG BGA chip.
    (Discard rate decreased significantly compared to the existing process)
  • Laser Displacement Sensor
    It is measured the high of PCB & BGA chip correctly by applying Laser Displacement Sensor.
  • Bit Abrasion Offset
    It is able to process more precise with applying auto offset for bit abrasion.
  • Additional Part Processing Function
    It is able to set up and additional processing for necessary part after 1st processing.
  • Camera Teaching
    It is available teaching accurately & easily to use camera
  • Bit Life Time Management
    It is able to set the bit life and if it is upon reaching the setting values, there is alarm for bit replacement.
  • Compact Design
    It is most compact desktop type design for securing customer space.

Options

  • Installation Table
    It is able to be settled with desktop type system for operating and installing.

Specifications(Standard)

 

Layout

BGA.jpg
 

Video

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