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Home Products > LASER Cutting Machine
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LS-NUN Laser Depaneling System

Features

  • Use various Laser source as UV, Green, IR, etc.
  • Cutting materials : FR4, FPCBs, Kapton, etc.
  • Thickness up to 1.2mm in the case of FR4 PCB
  • Pin Table, Production fixture
  • Full-cut process, Support high populated PCB panel
  • Best cutting quality(Minimize charring)
  • Clean process of particle and fume removal

Options

  • Easy setup of BDS(Beam Delivery System)
  • Automated Laser power management
  • Apply the optimized optic system
  • Incredible cost performance using 2 Table
  • Full graphic interface and easy programming
  • Real-time monitoring of key process parameters

Features

Options

Specifications(Standard)

 

Layout

 

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